Do standards inhibit creativity and innovation? It’s the age-old question. But for Seamless Air Alliance, an inflight connectivity standards group striving to create a more seamless connected experience for airline passengers, IFC hardware standards — including for aero modems — give manufacturers a competitive edge, as they ensure broad compatibility across platforms.
Earlier this year, the alliance took a critical step towards standardizing onboard satcom technology with the release of its Generation One IFC Modem Circuit Card Standard. For context, Seamless boasts a ‘who’s who’ of members, including Airbus and Boeing, top tier airlines, satellite operators and IFC suppliers.
Crafted by the alliance’s Modem Expert Working Group, as chaired by Kontron system engineer Rami Al Wazani, the Generation One IFC Modem Circuit Card Specification is the “first standard to address satellite modems installed inside a satellite communications modman (modem manager),” according to Seamless, and has been developed “to promote uniformity and interoperability in satcom modem designs for aviation platforms.”
It is applicable only to aero modems installed in the modman or the auxiliary modem unit (the supplemental box that allows a second or third satcom modem to be installed with the main modman on board aircraft). Each modem is specific to a single satellite network, and the hardware is usually positioned in the E&E Bay of larger commercial aircraft.
The new Seamless standard does not apply to a modem that is installed elsewhere, such as the early configuration adopted by Eutelsat OneWeb for its low earth orbit satellite service in aero. In that specific instance, the OneWeb modem, supplied by Hughes, is contained within the antenna controller and management unit. (For current multi-orbit LEO/GEO IFC solutions that include OneWeb service, a modem to support the geostationary satellite service would be positioned in the modman in the E&E Bay, whilst the OneWeb modem is closer to the fuselage-mounted antenna.)
Crucially, the new Seamless standard addresses some long-standing challenges. Historically, every modem was free to be built in any form factor, without regard to consistency in the input/output connections, and without a common method for control, power, and cooling. This required the modman to be customized to each modem.
The problems were magnified when the “dual-modem” modman entered the marketplace as multi-network IFC was pursued. (The first application was to support Inmarsat’s GX+ North America solution, a hybrid GX/Hughes high-capacity Ka-band IFC solution which required an Inmarsat GX modem from ST Engineering iDirect and a Hughes Jupiter modem. Inmarsat was later acquired by Viasat.)
And so, as part of its guidance, the new Seamless standard defines the physical dimensions and electrical interfaces for modem boards, ensuring compatibility across various systems. It also defines the IF/RF interface, LED indicators, discrete interfaces, and other communication protocols essential for modem integration; and addresses power, cooling, and environmental requirements. And it describes dual-modem functionality with clear operational modes for primary and secondary modems.
“[T]he Generation One IFC Modem Circuit Card Specification represents a critical leap forward in standardizing onboard satcom technology, accelerating time-to-market, and reducing developmental costs,” Seamless says.
It’s also timely, as airlines are increasingly eyeing and adopting multi-network architectures for inflight connectivity.
Seamless + ARINC
Seamless’ work to date has nicely paralleled and complemented ARINC standards for avionics; these are developed by industry experts and organizations, primarily through the SAE-ITC Airlines Electronic Engineering Committee (AEEC), and are used on more than 10,000 aircraft worldwide.
To wit, Seamless Air Alliance thought leader Peter Lemme served as AEEC subcommittee chair when the ARINC 791 and 792 standards were being drafted to define the characteristics of Ku- and Ka-band airborne satellite data terminals and their installations. ARINC 791 and modified versions are presently widely used in industry, especially for gimbaled antenna installs that talk to geostationary satellites and require a radome (those ‘humps’ we passengers are accustomed to seeing atop aircraft.)
In line with how IFC is evolving, work is now underway on the next-gen ARINC Project Paper 793, which will define a Ku/Ka-band satcom system that supports multiple modems.
In an example of how Seamless and ARINC are complementary, the generation one modem specification uses a coaxial interface to the Outside Antenna Equipment (OAE) that can be hosted in an ARINC 791/792 modman without physical modification, whilst a forthcoming generation two modem specification in development at Seamless will address emerging fiber optic, digital baseband interfaces as envisioned in ARINC Project Paper 793 which will see the coaxial interface swapped for a fiber optic interface.
ARINC Project Paper 793 will enable the use of electronically steerable antennae that can service one or more LEO and Medium Earth Orbit (MEO) satellite networks, supporting multiple beams.
“Ultimately, the adoption of the Generation One Modem Circuit Card Specification is an investment in the future of satcom technology for aviation,” Seamless says.
“It not only fosters greater industry collaboration but also ensures that airlines and their customers can enjoy the latest advancements in connectivity while simplifying the adoption of different satellite networks, with minimal disruption and greatest value.”
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- Seamless member Kontron pushes for common aero modem form factor
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Featured image credited to Inmarsat (now Viasat)